| 摘要: |
| 目的 研究使用 COMSOL Multiphysics 模拟微波炉加热包装食品的可行性。 方法 应用有限元分析软件 COMSOL Multiphysics 建立了食品介电性能随时间变化的电磁-热传导双向耦合模型,考虑加热过程中的表面热对流,模拟微波炉加热包装食品的过程,并与实验结果进行比较。 结果 食品内外温度分布的实验结果和模拟结果总体上接近,7 个特征点的模拟结果和实验结果接近,特征点最终温度的实验结果与模拟结果均方根误差为 1 . 75 ℃ 。 结论 使用 COMSOL Multiphysics 来进行微波炉加热包装食品的模拟是可行的。 |
| 关键词: 微波包装 微波加热 电磁场 温度场 |
| DOI： |
| 分类号:TB487;TS206 |
| 基金项目:国家科技支撑计划(2011BAD24B01) ;江苏省高校科研成果产业化推进工程项目( JHB2012-25) |
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| Simulation of Microwave Heating of Packaged Food by Software COMSOL |
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ZHANG Ke1, LU Li-xin1,2, WANG Jun1,2
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1.Jiangnan University, Wuxi 214122, China;2.Jiangsu Province Key Laboratory of Advanced Food Manufacturing Equipment and Technology, Wuxi 214122, China
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| Abstract: |
| Objective To investigate the feasibility of simulating microwave heating of packaged food by COMSOL Multiphysics . Methods A time-dependent electromagnetic and heat transfer coupling model was established to simulate the process of microwave heating of food by FEM software COMSOL Multiphysics,and the simulation results were compared with experimental results. Results The results showed that the simulation results of food temperature distribution were similar to the experimental results, the simulation results of 7 feature points were close to the experimental results,and the root mean square error of final temperature of feature points between experimental results and simulation results was 1. 75 ℃ . Conclusion It was confirmed that the simulation of microwave heating of packaged food by COMSOL Multiphysics is feasible. |
| Key words: microwave package microwave heating electromagnetic field temperature field |
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