| 摘要: |
| 为检测轻工业产品的密封性能，应用电子错位散斑法对密封盖、药用密封装置以及食品塑封进行了检测。结果表明：电子错位散斑法能够较好地识别不同密封装置，不同部位，大小、形状各不相同的缺陷，迅速准确地对塑料密封结构质量做出判断；该方法操作简便，对缺陷部位敏感，能够较好地应用于实际现场测试。 |
| 关键词: 无损检测 电子剪切散斑法 塑封材料 |
| DOI： |
| 分类号:TB487; TB484.3 |
| 基金项目:上海市教育委员会一般项目（060Z028） |
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| Nondestructive Examination of Plastic Sealing Materials by ESSPI |
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MI Hong-lin1,2, HE Xiao-yuan3
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1.Shanghai Institute of Technology, Shanghai 200235, China;2.Southeast University, Nanjing 210096, China;3.Southeast University, Nanjing 210096, China
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| Abstract: |
| In order to test the sealed performance of plastic product for light industry, sealed cap, medical sealed device and sealed part for food plastic bag were tested by ESSPI technique respectively. The results showed that deflects of different sealed devices, different parts, dimensions, and shape can be identified by ESSPI method. Simultaneously, this technique is convenience for operation and is very sensitive to the deflective parts. ESSPI method can be used in nondestructive test on spot. |
| Key words: nondestructive test electronic shear speckle pattern interferometry (ESSPI) sealing plastic material |
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