| 摘要: |
| 目的 采用非等温差示扫描量热法(DSC)和傅里叶红外光谱(FT–IR)研究海因环氧/双酚A型氰酸酯(BAE)和海因环氧/四甲基双酚F型氰酸酯(TBF)的固化反应行为。方法 通过Kissinger、Ozawa和Crane法对2种树脂体系的固化动力学参数进行了计算，并采用热重分析(TGA)和热机械分析(DMA)评价树脂改性前后的热稳定性和热力学性能。结果 海因环氧改性氰酸酯树脂体系均呈现双重固化放热峰，TBF体系具有相对更高的表观活化能，而BAE体系具有更好的耐热性能，其玻璃化转变温度(tg)和在氮气下质量损失率为5%时的温度分别为271.6 ℃和403.4 ℃。结论 海因环氧树脂可以促进氰酸酯的聚合反应，制备的改性树脂体系可用于耐高温树脂基体和电子封装等材料。 |
| 关键词: 氰酸酯 环氧树脂 固化动力学 热性能 |
| DOI：10.19554/j.cnki.1001-3563.2023.07.004 |
| 分类号:TQ322.4+1 |
| 基金项目:博士科研启动项目(2019DS089) |
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| Curing Behavior of Cyanate Resin System Modified by Hydantoin Epoxy |
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WANG Ying
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(College of Light Industry, Harbin University of Commerce, Harbin 150028, China)
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| Abstract: |
| The work aims to study the curing reaction behavior of hydantoin epoxy/bisphenol A-type cyanate (BAE) and hydantoin epoxy/tetramethyl bisphenol F-type cyanate (TBF) by nonisothermal differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FT-IR). The curing kinetic parameters of the two resin systems were calculated by Kissinger, Ozawa and Crane methods. Thermogravimetric analysis (TGA) and thermo-mechanical analysis (DMA) were used to evaluate the thermal stability and thermodynamic properties of the resin before and after modification. The modified cyanate resin systems exhibited dual curing exothermic peaks, and the TBF system had relatively higher apparent activation energy, while the BAE system possessed better heat resistance and had a glass transition temperature (tg) of 271.6 ℃ and a thermal decomposition temperature of 403.4 ℃ at a mass rate of 5% under nitrogen. The hydantoin epoxy resin can promote the polymerization of cyanate ester, and the modified resin system can be used in high temperature resistant resin matrix and electronic packaging materials. |
| Key words: cyanate ester epoxy resin curing kinetics thermal properties |
