引用本文:李杨,李新娥,张瑜,梁彦斌.物品贮运环境监测系统的抗冲击性能仿真分析[J].包装工程,2016,37(15):116-119.
【打印本页】   【下载PDF全文】   查看/发表评论  【EndNote】   【RefMan】   【BibTex】
←前一篇|后一篇→ 过刊浏览    高级检索
本文已被:浏览 2837次   下载 1972 本文二维码信息
码上扫一扫!
分享到: 微信 更多
物品贮运环境监测系统的抗冲击性能仿真分析
李杨1,2, 李新娥1,2, 张瑜1,2, 梁彦斌1,2
1.中北大学 a.电子测试技术国家重点实验室;2.b.仪器科学与动态测试教育部重点实验室,太原 030051
摘要:
目的 设计一种能实时监测物品贮运过程中的温度、湿度、加速度等3个参数并进行数据采集存储,同时能记录时间的具有高可靠性的贮运环境监测系统。方法 通过有限元分析软件Ansys对壳体及电路板分别进行有限元抗冲击仿真。结果 由壳体在冲击作用下的最大变形为0.03 mm及25.5 MPa的Von Miss等效应力证明壳体具有抗冲击可靠性,对电路板进行模态分析的结果证明,电路在环境冲击作用下能够可靠工作。结论 设计的贮运环境监测系统具有良好的可靠性。
关键词:  ARM  环境监测  采集存储  Ansys  模态分析
DOI:
分类号:TN41
基金项目:
Simulation for Anti-impact Performance of Monitoring System in Storage and Transportation
LI Yang1,2, LI Xin-e1,2, ZHANG Yu1,2, LIANG Yan-bin1,2
1.North University of China a.National Key Laboratory for Electronic Measurement Technology;2.b.Key Laboratory of In-strumentation Science and Dynamic Measurement, North University of China, Taiyuan 030051, China
Abstract:
This work aims to design an environmental monitoring system with high reliability that can monitor real-time temperature, humidity, acceleration in the storage and transportation process, collect data and record time. Finite element impact simulation was conducted on the circuit and shell by finite element analysis software Ansys. The maximum deformation of the shell was 0.03 mm and the Von Miss equivalent stress was 25.5 MPa under the impact effect. That proved the shell had shock resistance reliability. The results of PCB modal analysis proved that the circuit board could reliably work under the environmental impact. In conclusion, the designed environment monitoring system in storage and transportation has good reliability.
Key words:  ARM  environmental monitoring  collection and storage  Ansys  modal analysis

关于我们 | 联系我们 | 投诉建议 | 隐私保护

您是第24463783位访问者    渝ICP备15012534号-2

版权所有:《包装工程》编辑部 2014 All Rights Reserved

邮编:400039 电话:023—68792836传真:023—68792396 Email: designartj@126.com

    

  
 

渝公网安备 50010702501717号